Jiangxi Xintao Technology Co., Ltd. has successfully exported ten tons of white silica gel to an East Asian customer for semiconductor packaging applications. The collaboration began with 100g samples meeting the client’s stringent moisture content requirement of <1%. Following sample approval, the customer placed an initial trial order of 1000kg, which delivered positive results but prompted a request for larger bead sizes. After confirming the second sample met their revised specifications, the customer proceeded with a 10-ton order.
White Silica Gel Dessicant In Semiconductor Packaging
Silica gel is a kind of material with excellent characteristics and is widely used in the semiconductor packaging industry. During the manufacturing process of semiconductor devices, packaging and protection are crucial steps, and silica gel is an ideal sealing material for this purpose. Here are the main applications of silica gel in the semiconductor packaging industry:
- Bonding and Encapsulation: silica gel can be used to encapsulate semiconductor chips, through bonding with chips and other packaging materials to form a protective packaging layer to prevent the intrusion and damage of external substances, and to improve the stability and reliability of the chip.
- Thermal Management: Silicagel performs good thermal conductivity, which allows it to effectively dissipate the heat generated by electronic devices into the surrounding environment. This helps maintain the normal operating temperature of the devices, preventing performance decline and damage caused by overheating.
- Electrical Insulation and Moisture Resistance: Silicagel has excellent electrical insulation properties and moisture resistance, whichcan be used to isolate and protect devices from electromagnetic interference and humid environments during the semiconductor packaging process.
- Dustproof and Shock Resistance: The sealed layer of silicagel can effectively prevent dust and particles from entering, keeping the device surface clean and tidy. Moreover, the flexibility of silicagel provides shock resistance, enhancing the device’s ability to withstand vibrations.
Xintao's White Silica Gel
Xintao’s white silica gel consistently maintains moisture content below 1%, meeting the precise requirements of semiconductor manufacturing. Beyond standard white silica gel, our product range includes color-indicating variants in blue and orange for visual moisture monitoring. This technical capability, combined with our flexible manufacturing processes allowing for customized bead sizes, positions Xintao as a reliable partner for high-purity industrial materials.
Our expertise in producing specialized silica gels continues to support technological advancements across electronics manufacturing sectors, with proven performance in critical applications where material purity and consistency determine end-product reliability.
